SIMATIC ET200SP Fail-Safe I/O Modules Are Now Available

Siemens Industry, Inc., announced that the failsafe digital modules F-DI 8x24VDC HF, F-DO 4x24VDC 2A PM HF, and the power module F-PM-E 24VDC 8A PPM ST for the ET 200SP distributed I/O system have been released for delivery. These modules are the first to support the “No DIP” concept; the PROFIsafe address assignment via DIP switches is no longer necessary with the use of these modules.

Product Overview

These failsafe digital modules for digital inputs and outputs have the same size as the standard modules at 15 mm. Their functional safety is certified to IEC 61508. They are designed for failsafe applications up to SIL 3 in compliance with IEC 62061 and PL e in compliance with ISO 13849-1.

A special feature of the F-modules of SIMATIC ET200SP is the station-wide assignment of the F-addresses via the engineering, instead of setting them via DIP switches for each module. If a module is replaced, then the F-address, which is stored as e-coding, remains in the Base Unit. When the new module is inserted, it will receive the F-address automatically. Therefore, a new assignment of the F-address is not necessary. This new feature simplifies the assignment process and saves significant time and effort.

The failsafe power module of the SIMATIC ET 200SP enables failsafe groups of standard or failsafe DO modules to be switched off. The evaluation of the safety function is optionally in the F-CPU or in the power module F-PM-E. This fast and direct switching off of groups is available up to SIL2 / PL d or SIL 3 / Pl e.

An important new feature of the F-DI 8x24VDC HF of ET 200 SP is its incorporation of eight sensor supplies that can be configured independently of the digital channels to enable a flexible assignment to the most different sensors.

For more detailed information on the ET200SP Fail-Safe I/O modules, go to http://www.automation.siemens.com/mcms/distributed-io/en/ip20-systems/et-200sp/failsafe-io/Pages/Default.aspx.

###

Have an Inquiry for Siemens about this article? Click Here >>
 
 

Leave a Reply

Your email address will not be published. Required fields are marked *